3D-printed cooling tech offers energy fix for overheated data centers

The AM2PC European research project, led by the Danish Technological Institute and Heatflow with partners from Belgium and Germany, has developed an innovative 3D-printed cooling solution for data centers and high-performance computing systems. This new cooling technology uses passive two-phase cooling based on the thermosiphon principle, where a coolant evaporates at the chip surface, rises, condenses, and returns by gravity without pumps or fans. This method efficiently removes heat—achieving a cooling capacity of 600 watts, 50% above the initial target—while consuming no additional energy for heat transport. This approach addresses the growing challenge of rising GPU power demands, which have outpaced traditional air cooling capabilities, and helps extend chip lifespan by maintaining lower operating temperatures. The core component is a 3D-printed aluminum evaporator that integrates all necessary functions into a single, leak-resistant, and reliable part, made possible through additive manufacturing. Operating at heat removal temperatures between 60 and 80 degrees Celsius