China builds most advanced chipmaking machine, cracks EUV barrier

China has reportedly achieved a significant milestone in semiconductor manufacturing by developing its first domestic prototype of an extreme ultraviolet (EUV) lithography machine, a technology previously monopolized by Dutch company ASML. EUV lithography is a highly complex process essential for producing the world’s most advanced microchips, involving powerful lasers that generate ultraviolet light to etch circuits at an atomic scale. China’s breakthrough reportedly involved reverse-engineering older ASML parts and poaching talent, despite US efforts to block access to this technology. This advancement surpasses earlier expert predictions, including statements from ASML’s CEO who had anticipated China would need many more years to reach this level. While China has not yet begun mass production of EUV chips, the development of a working prototype marks a crucial step toward mainstreaming the technology by 2030. This progress comes amid a global race, particularly between the US and China, to enhance semiconductor manufacturing capabilities driven by the growing demand for AI and advanced electronics. In response, China’s