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Articles tagged with "semiconductor-manufacturing"

  • Taiwan builds 20-qubit quantum computer in domestic R&D push

    Researchers at Taiwan’s Academia Sinica have developed a 20-qubit superconducting quantum computer entirely through domestic research and fabrication efforts, marking a significant advancement from their earlier 5-qubit system introduced in 2023. This new platform, now accessible to local researchers, demonstrates Taiwan’s capability to produce larger-scale, stable quantum chips suitable for complex quantum simulations and testing. The project leveraged semiconductor manufacturing expertise to overcome challenges in qubit uniformity, coupling precision, and interference, employing techniques like laser trimming and chip stacking to enhance performance and reduce crosstalk. A major breakthrough of the 20-qubit system is the substantial increase in qubit coherence time—from 15–30 microseconds in the previous model to 530 microseconds—allowing quantum states to remain stable for longer periods, which is critical for practical quantum computing. This improvement reflects tighter control over fabrication, packaging, and noise reduction, addressing the sensitivity of superconducting qubits to electromagnetic disturbances. Academia Sinica plans to further

    quantum-computingsuperconducting-qubitsquantum-chip-fabricationmaterial-discoveryhigh-performance-computingsemiconductor-manufacturingquantum-simulation
  • Self-etching process opens new pathways for 2D perovskite electronics

    A collaborative research team from China and the US has developed a novel semiconductor fabrication method called self-etching, which addresses the limitations of conventional lithography in working with delicate two-dimensional (2D) lead halide perovskite materials. Traditional lithography techniques, which rely on vertical laser etching, often cause damage due to sideways light scattering, especially problematic for soft, chemically unstable materials like 2D perovskites. The new self-etching approach leverages the internal stress within growing perovskite crystals to form controlled lateral microstructures from within, enabling precise nanoscale patterning without the damage caused by conventional photolithography or harsh chemical solvents. This breakthrough offers a new material platform and design pathway for high-performance light-emitting and integrated electronic devices, overcoming the machining challenges that have limited the use of 2D perovskites in advanced semiconductor applications. The method allows the creation of pixel-like units with tunable color and brightness, resulting in single crystal waf

    materialssemiconductor-manufacturing2D-perovskitesself-etching-processnanofabricationoptoelectronicschip-fabrication
  • Intel veteran Sanjay Natarajan on Moore's Law and the limits of digital scaling

    Sanjay Natarajan, a veteran semiconductor engineer and former Senior Vice President at Intel, challenges the notion that Moore’s Law has reached an absolute end. With a career spanning over three decades, including leading Intel’s critical 32-nanometer and 14-nanometer process technology developments, Natarajan witnessed and contributed to overcoming the escalating challenges of chip scaling such as rising costs, physical limitations, and manufacturing complexities. His work consistently focused on extending performance and yield by adopting fundamentally new approaches for each successive technology node, demonstrating that the evolution of semiconductor technology is an ongoing process rather than a halted one. Natarajan’s passion for electrical engineering began early, inspired by the emergence of personal computing and hands-on experience with an Apple II Plus. His long tenure at Intel was driven not only by the intellectual challenges and innovation opportunities but also by the impact of seeing his work widely adopted globally. He credits Intel’s leadership in CMOS technology and its collaborative environment as key factors in his sustained motivation.

    semiconductorsMoore's-Lawchip-scalingprocess-technologyIntelnanometer-technologysemiconductor-manufacturing
  • Taiwan to invest $250B in US semiconductor manufacturing

    The Trump administration has secured a significant multi-billion-dollar trade deal with Taiwan aimed at boosting U.S. domestic semiconductor manufacturing. Under the agreement, Taiwanese semiconductor and technology companies will invest $250 billion directly into the U.S. semiconductor industry, covering sectors such as semiconductors, energy, and AI production and innovation. Additionally, Taiwan will provide $250 billion in credit guarantees to support further investments from these enterprises. The timeline for these investments has not been specified. In exchange, the U.S. will invest in Taiwan’s semiconductor, defense, AI, telecommunications, and biotech industries, though no specific investment amount from the U.S. side was disclosed. This deal aligns with the U.S. government’s broader strategy to reduce dependence on foreign semiconductor supply chains, which currently see only about 10% of semiconductors produced domestically. The administration emphasized that reliance on foreign supply chains poses significant economic and national security risks, potentially impacting industrial and military capabilities. The announcement also hinted at forthcoming semiconductor tariffs once

    semiconductorssemiconductor-manufacturingTaiwanUS-Taiwan-trade-dealenergy-innovationAI-productiontechnology-investment
  • UK orbital factory tests key furnace conditions to make next‑gen chips

    The Cardiff-based startup Space Forge has successfully tested a high-temperature furnace aboard its ForgeStar-1 satellite, marking a significant advancement in space manufacturing. The compact "orbital factory" reached temperatures of 1,832°F (1,000°C), enabling the production of ultra-pure semiconductor crystals for use in electronics such as communications, computing, and transportation. Utilizing the microgravity environment of space, Space Forge aims to create semiconductor materials up to 4,000 times purer than those made on Earth, as the absence of gravity and molecular contaminants allows atoms to align with exceptional precision. While the technology is still in its early stages, the mission demonstrated the core capability for in-space manufacturing, including successfully generating plasma within the furnace. A major challenge remains in safely returning the manufactured materials to Earth without damage during re-entry. To address this, Space Forge is developing an innovative deployable heat shield called Pridwen, designed to radiate heat away rather than absorb it, unlike traditional shields. The

    materialssemiconductor-manufacturingspace-manufacturingmicrogravityorbital-factoryhigh-temperature-furnaceadvanced-materials
  • Humanoid robots to join chip production factories for the first time

    European semiconductor leader STMicroelectronics (ST) has partnered with Italian firm Oversonic Robotics to deploy RoBee, a custom cognitive humanoid robot, in semiconductor manufacturing for the first time. This marks the inaugural use of humanoid robots in logistics and production within semiconductor factories. RoBee is uniquely certified for both industrial and healthcare sectors and is designed to autonomously operate in complex environments, enhancing collaboration with human workers through AI-driven perception, decision-making, and interaction capabilities. Its applications include pick-and-place tasks, real-time data collection, and integration with industrial automation systems to improve production planning and logistics. STMicroelectronics emphasized that scaling automation and robotics, including humanoid integration, is critical for maintaining long-term competitiveness and improving product quality. The deployment of RoBee aims to support complex manufacturing flows, shorten cycle times, increase employee safety, and boost operational efficiency. This initiative underscores ST’s commitment to pioneering strategic and sustainable technologies in the semiconductor industry. The collaboration’s international launch will be showcased through live demonstrations

    robothumanoid-robotssemiconductor-manufacturingindustrial-automationcognitive-roboticsAI-in-manufacturinglogistics-automation
  • Tonight, the future of deep tech will be explained to you at StrictlyVC Palo Alto

    The final StrictlyVC event of 2025 is taking place tonight at Playground Global in Palo Alto, featuring a lineup of leading deep tech innovators and investors who will share insights on groundbreaking technologies shaping the future. The event continues the series’ tradition of intimate gatherings that spotlight important but not yet widely recognized developments, with past highlights including early discussions on OpenAI’s monetization strategy. This year’s speakers include Nicholas Kelez, a particle accelerator physicist developing next-generation semiconductor manufacturing technology in the U.S. to reduce reliance on expensive European laser machines, and Mina Fahmi, co-founder of Sandbar, which has created a “Stream Ring” that converts whispered thoughts into text, extending human cognitive capabilities. Other notable presenters include Max Hodak, co-founder of Neuralink and founder of Science Corp., who has restored vision to blind patients with retinal implants and is now pioneering biohybrid brain-computer interfaces that integrate stem cell-grown chips into brain tissue to help paralyzed individuals control devices with their

    energysemiconductor-manufacturingparticle-accelerator-technologybrain-computer-interfacesbiohybrid-technologyretinal-implantsadvanced-chips
  • The future of deep tech will be explained to you at StrictlyVC Palo Alto on Dec 3

    The final StrictlyVC event of 2025 will take place on December 3 at PlayGround Global in Palo Alto, featuring leading innovators in deep tech who will share insights on groundbreaking developments shaping the future. The event continues StrictlyVC’s tradition of intimate gatherings that spotlight transformative technologies before they become widely recognized. Highlights include Nicholas Kelez, a particle accelerator physicist addressing semiconductor manufacturing challenges by developing next-generation chip production technology in the U.S., and Mina Fahmi, co-founder of Sandbar, who has created a “Stream Ring” that converts whispered thoughts into text, extending human cognitive capabilities. Other notable speakers include Max Hodak, co-founder of Neuralink and founder of Science Corp, who has advanced retinal implants restoring vision and is now pioneering biohybrid brain-computer interfaces to help paralyzed individuals control devices with their thoughts. Venture capitalists Chi-Hua Chien (Goodwater Capital) and Elizabeth Weil (Scribble Ventures) will also share their perspectives, critiqu

    materialssemiconductor-manufacturingparticle-accelerator-technologybrain-computer-interfacesbiohybrid-technologyenergyadvanced-chips
  • The future will be explained to you in Palo Alto

    The article previews the final StrictlyVC event of 2025, hosted by PlayGround Global in Palo Alto, which brings together leading innovators working on groundbreaking technologies before they become widely recognized. Highlighted speakers include Nicholas Kelez, a particle accelerator physicist developing next-generation semiconductor manufacturing tools to reduce reliance on expensive European laser machines; Mina Fahmi and Kirak Hong, creators of the Stream Ring, a device designed to extend cognitive capabilities by capturing whispered thoughts; and Max Hodak, cofounder of Neuralink, who is advancing “biohybrid” brain-computer interfaces that integrate stem-cell-seeded chips into brain tissue to help paralyzed individuals control devices with their minds. Hodak envisions transformative changes by 2035. The event also features venture capitalists Chi-Hua Chien and Elizabeth Weil, who have backed major tech successes like Twitter, Spotify, and TikTok. They argue that Silicon Valley is misreading the AI moment by focusing heavily on enterprise AI, while the

    energysemiconductor-manufacturingparticle-accelerator-technologybrain-computer-interfacesbiohybrid-chipsneural-implantsadvanced-materials
  • PI releases H-815 hexapod robot for industrial applications - The Robot Report

    PI Physik Instrumente L.P. (PI) has launched the H-815, a six-axis hexapod robot designed for continuous 24/7 industrial operation. This compact and robust parallel kinematic motion system offers high reliability, fast velocity (up to 20 mm/s), and ultra-precise movement with six degrees of freedom (X, Y, Z, pitch, roll, yaw). Engineered for applications in silicon photonics, semiconductor manufacturing, optics, metrology, automotive, electronics, and photonics, the H-815 features high-quality cardanic joints with Z-offset for superior stiffness and backlash-free operation, even in varied orientations. Its low-profile design (155 mm height, 222 mm baseplate diameter) supports a 10 kg load capacity, enabling integration into existing production lines. The H-815 uses ball-screw actuators with absolute-measuring encoders on all six axes, eliminating the need for referencing and reducing startup time while enhancing precision. It achieves

    robotindustrial-automationhexapod-robotprecision-motionsemiconductor-manufacturingphotonicsrobotics-engineering
  • China's new cryogenic trick can reduce 99% of microchip defects

    Chinese researchers from Peking University, Tsinghua University, and the University of Hong Kong have developed a novel cryo-electron tomography (cryo-ET) technique to dramatically reduce defects in microchip manufacturing, specifically during the photolithography process. Photolithography involves using light to pattern circuits on silicon wafers coated with a photoresist, but microscopic particles formed during the chemical development stage often cause defects that ruin chips, especially at cutting-edge 5-nanometer or smaller nodes. Previously, manufacturers could not observe the behavior of the photoresist developer liquid in detail, making defect causes difficult to pinpoint. By rapidly freezing the developer liquid at –175°C mid-process and using electron tomography to create 3D molecular-level images, the team discovered that photoresist polymers form tangled clumps through weak hydrophobic interactions, creating 30–40 nm particles. About 70% of these molecules fail to dissolve properly and accumulate at the air-liquid interface, later redepositing on

    materialssemiconductor-manufacturingmicrochip-defectscryo-electron-tomographyphotolithographychip-productionnanotechnology
  • Nvidia expands AI ties with Hyundai, Samsung, SK, Naver

    Nvidia CEO Jensen Huang is visiting South Korea to announce expanded collaborations with major Korean technology companies—Hyundai Motor, Samsung, SK Group, and Naver—alongside the South Korean government. This partnership aims to significantly boost South Korea’s AI infrastructure and physical AI capabilities, with the country securing over 260,000 of Nvidia’s latest GPUs. Approximately 50,000 GPUs will support public initiatives, including a national AI data center, while the remaining GPUs will be allocated to leading companies to drive AI innovation in manufacturing and industry-specific AI model development. This move follows recent U.S. technology agreements with Japan and South Korea to enhance cooperation on emerging technologies such as AI, semiconductors, quantum computing, biotech, and 6G. Key collaborations include Samsung and Nvidia’s joint effort to build an AI Megafactory that integrates AI across semiconductor, mobile device, and robotics manufacturing using over 50,000 Nvidia GPUs and the Omniverse platform. They are also co-developing AI

    AIroboticssmart-factoriesautonomous-mobilitysemiconductor-manufacturingAI-infrastructureGPU-technology
  • 2024’s Startup Battlefield runner-up geCKo Materials reveals four new products at TechCrunch Disrupt

    geCKo Materials, the runner-up in the 2024 TechCrunch Disrupt Startup Battlefield, unveiled four new products that leverage its super-strong dry adhesive technology inspired by lizard feet. The new applications include a semiconductor wafer handling tool, a robotic gripper for smooth surfaces like solar panels and glass, a curved robotic end effector for irregular shapes, and a versatile gripper for robotic arms. This adhesive acts like a residue-free, reusable Velcro alternative that requires no electrical charge or suction, capable of holding 16 pounds per square inch and enduring up to 120,000 attachment cycles. Its adaptability to manufacturing and robotic applications has attracted major customers such as Ford, NASA, and Pacific Gas & Electric. Since last year’s Battlefield appearance, geCKo has tripled its team size, raised $8 million, and seen its adhesive used on six space missions, demonstrating its effectiveness in diverse environments including vacuum. Founder Dr. Capella Kerst highlighted the technology’s superior performance in semiconductor

    materialsroboticsdry-adhesivesemiconductor-manufacturingrobotic-grippersspace-technologyindustrial-automation
  • China tightens export controls on rare earth minerals once again

    China has tightened its export controls on rare earth minerals and related mining and refining technologies, adding five more rare earth elements to its export control list, bringing the total to 12. The Commerce Ministry announced that foreign producers must now apply for export licenses if their products contain any Chinese-origin rare earth minerals or related technology. Defense organizations will be denied licenses, while semiconductor manufacturers will undergo individual reviews. Exemptions are made for exports intended for humanitarian aid, such as public health emergencies and disaster relief. As the world’s largest producer of rare earth minerals, China is leveraging these controls to safeguard national security amid increasing global competition in semiconductor manufacturing. This move mirrors recent U.S. export restrictions on chipmaking equipment aimed at limiting China’s technological advancements. The announcement follows Beijing’s April decision to add several rare earth minerals to its export control list in response to U.S. tariffs under the Trump administration, which had already caused significant global supply shortages. Rare earth minerals remain critical for industries including solar energy, electric vehicles

    rare-earth-mineralsexport-controlssemiconductor-manufacturingenergy-materialselectric-vehicle-batteriessupply-chain-securityChina-trade-policy
  • PI releases high dynamics linear motor stage family - The Robot Report

    PI Physik Instrumente L.P. has introduced the V-573 family, a new series of high-dynamics linear motor stages designed for ultra-precise positioning in research and industrial applications. Manufactured in the U.S., these stages feature frictionless three-phase linear motors, crossed roller bearings for high stiffness and smooth operation, and offer specifications such as up to 360mm travel, 1nm absolute encoder resolution, 80nm bidirectional repeatability, and velocities up to 500mm/sec with 1g acceleration. The design emphasizes precision with straightness and flatness values as low as 1µm, and includes an anti-creep mechanism to enhance reliability. The stages integrate with PI’s ACS-based EtherCAT motion controllers, enabling optimized system performance through advanced algorithms. The V-573 stages are suitable for a broad range of industries including semiconductor manufacturing (nano-lithography, wafer inspection, metrology), silicon photonics, quantum computing, industrial automation, microscopy, and life sciences

    robotautomationlinear-motorprecision-motionsemiconductor-manufacturingindustrial-automationmotion-control
  • US firm's sensor for high-purity industry to boost semiconductor making

    Honeywell, a North Carolina-based company, has developed the 13MM Pressure Sensor designed specifically for high-purity industries such as semiconductor manufacturing. This advanced sensor operates accurately under high-pressure and high-temperature conditions with minimal offset drift, addressing a common issue where other sensors “drift” in vacuum environments and lose accuracy over time. The 13MM sensor complies with strict semiconductor industry standards (SEMI F20) for metal composition and surface roughness, helping to minimize contamination and defects during wafer fabrication, thereby improving yield and reducing wafer scrap. Beyond semiconductor production, the sensor is applicable in other ultra-high purity environments including solar panel and display manufacturing, biopharmaceuticals, food and beverage, advanced optics, and medical equipment. Its rugged, media-isolated stainless steel design features a piezoresistive semiconductor sensor chip housed in an oil-isolated package, offering exceptional corrosion resistance and durability against aggressive halogenated gases common in semiconductor processes. Honeywell emphasizes that the sensor’s stability and precision

    semiconductor-manufacturingpressure-sensorhigh-purity-industriesHoneywell-sensing-solutionswafer-fabricationadvanced-sensorscleanroom-technology
  • The Trump administration is going after semiconductor imports

    The Trump administration is reportedly considering a new policy aimed at boosting U.S. semiconductor production by enforcing a 1:1 manufacturing ratio. Under this approach, domestic semiconductor companies would be required to produce as many chips in the U.S. as their customers import from overseas manufacturers. Companies failing to meet this ratio could face tariffs, although the timeline for achieving this target remains unclear. This move is part of President Donald Trump’s broader efforts, initiated in August, to impose tariffs on the semiconductor industry and encourage reshoring of chip manufacturing. While the ratio-based policy could eventually increase domestic chip production, it poses significant challenges in the short term. Semiconductor manufacturing plants are complex and costly to build, with long lead times before becoming operational. For example, Intel’s Ohio plant, initially expected to open in 2025, has been delayed until 2030. Meanwhile, Taiwan Semiconductor Manufacturing Company (TSMC) has announced plans to support chip production infrastructure in the U.S., but details remain sparse. The proposed

    materialssemiconductor-manufacturingchip-productiontariffssupply-chaintechnology-policyUS-manufacturing
  • New chemistry shrinks microchips past the limits of human sight

    Johns Hopkins researchers have developed a novel microchip manufacturing process that enables circuits to be carved with unprecedented precision at the 229-nanometer scale, producing features smaller than what the human eye can see. This advancement leverages new materials and laser techniques to create ultra-small, faster, and more cost-effective microchips suitable for widespread applications including smartphones and aerospace. The innovation addresses a key industry challenge: finding materials and processes that can endure the intense radiation needed to etch such tiny details economically and reliably in large-scale production. Central to this breakthrough is the use of metal-organic resists composed of metals like zinc combined with an organic compound called imidazole. These resists can withstand beyond extreme ultraviolet (B-EUV) radiation, which traditional materials cannot tolerate. The team employed a chemical liquid deposition (CLD) method to precisely engineer and test various metal-imidazole combinations, discovering that different metals perform optimally at different radiation wavelengths. Zinc, for example, is particularly effective for B

    materialsmicrochipssemiconductor-manufacturingnanotechnologymetal-organic-compoundslithographychemical-deposition
  • Why the U.S. government is not the savior Intel needs

    The Trump administration recently announced a controversial plan to convert government grants originally intended for Intel into a 10% equity stake in the company. This move, unprecedented and legally uncertain, aims to support Intel but does not address the company’s core challenges, particularly its struggling Intel Foundry division. Intel Foundry, responsible for manufacturing custom semiconductors for external customers, has failed to secure major contracts and has operated at a loss, contributing to layoffs and internal leadership changes. Industry experts argue that Intel’s problems stem less from funding shortages and more from a flawed customer service approach and internal culture that prioritizes manufacturing over client relationships. Intel itself has acknowledged risks associated with the government equity deal, including dilution of existing shareholders’ stakes and potential negative impacts on its international business, which accounts for the majority of its revenue. The involvement of the U.S. government as a partial owner could complicate Intel’s relationships with foreign customers amid ongoing trade tensions. While some analysts view the government’s intervention as a positive sign of

    materialssemiconductor-manufacturingIntel-Foundrygovernment-grantsequity-stakechip-industrysemiconductor-industry
  • SoftBank makes $2B investment in Intel

    Japanese conglomerate SoftBank has agreed to invest $2 billion in Intel by purchasing common stock at $23 per share, signaling a strong commitment to advanced semiconductor technology and manufacturing in the United States. The deal, announced after market hours on August 18, 2025, led to a more than 5% increase in Intel’s share price. SoftBank Group Chairman and CEO Masayoshi Son emphasized that the investment reflects confidence in the expansion of U.S.-based semiconductor manufacturing, with Intel playing a pivotal role, especially amid growing interest in AI chip development. This investment serves as a significant validation for Intel, which has faced competitive pressures from companies like Nvidia and is currently undergoing a restructuring under new CEO Lip-Bu Tan. Intel is focusing on streamlining its semiconductor business, particularly its client and data center segments, while reducing workforce in its Intel Foundry division. The deal also aligns with SoftBank’s renewed focus on the U.S. market and AI technologies, complementing its recent activities such

    semiconductorsAI-chipsIntelSoftBankadvanced-technologysemiconductor-manufacturingdata-centers
  • Trump says he’ll announce semiconductor and chip tariffs

    President Donald Trump announced plans to impose tariffs on semiconductors and chips as early as next week, though specific details about these tariffs have not yet been disclosed. This move could significantly disrupt U.S. hardware and AI companies, which rely heavily on semiconductor imports. Despite the U.S. producing only a small portion of the world’s chips, it remains home to many leading semiconductor companies. Efforts to boost domestic chip manufacturing have been underway since the 2022 CHIPS Act, which allocated $52 billion in subsidies to increase U.S. production capacity, with companies like Intel investing in new manufacturing facilities. The tariff announcement coincides with ongoing deliberations over AI chip export restrictions. The Trump administration has criticized the Biden administration’s multi-tiered export control rules introduced in May, which limit sales of advanced AI semiconductors to certain countries for national security reasons. In July, the Trump administration released a policy framework emphasizing the need for chip export restrictions but without detailed proposals. Recent reports suggest the Trump administration

    semiconductorschip-tariffssemiconductor-manufacturingAI-chipsexport-restrictionschip-industrytechnology-policy
  • J.P. Morgan reports on U.S. investment trends in applied tech - The Robot Report

    J.P. Morgan’s recent “Applied Tech Report” highlights ongoing investment growth in U.S. sectors such as robotics, semiconductors, space, and defense, despite macroeconomic challenges like higher interest rates and market pressures. While IPOs and early-stage investments have remained steady or declined, market consolidation and strategic partnerships underscore confidence in the long-term potential of applied technologies. Government funding plays a significant role, with U.S. federal spending reaching $338 billion in fiscal year 2024, driven by programs like the CHIPS Act and Department of Defense contracts to startups. Venture funding has decreased since 2021, but federal support, especially for AI research and development, is expected to increase. Capital investment in robotics startups has notably increased from about $7 billion in 2020 to over $12 billion in 2024, largely due to advances in AI and rising demand for automation to address labor shortages and productivity needs. Robotics investments tend to focus on later-stage companies requiring substantial capital to scale,

    robotrobotics-startupsautonomous-systemssemiconductor-manufacturingdefense-technologyartificial-intelligenceautomation
  • SOSV bets plasma will change everything from semiconductors to spacecraft

    SOSV, a venture capital firm, is making a significant bet on plasma technology, planning to invest in over 25 plasma-related startups within the next five years. The firm is also launching a new Hax lab in collaboration with the New Jersey Economic Development Authority and the U.S. Department of Energy’s Princeton Plasma Physics Laboratory to foster innovation in this space. Plasma, a state of matter created by compressing fuel until atoms fuse and release energy, holds promise far beyond fusion energy alone. Duncan Turner, SOSV’s general partner, highlights that the best applications of plasma are yet to be discovered, indicating vast untapped potential. Beyond fusion, SOSV has already invested in companies like Yplasma, which utilizes plasma actuators for cooling data center chips and optimizing airflow over wind turbine blades. Plasma’s role in semiconductor manufacturing could lead to breakthroughs in materials and processes, while plasma thrusters offer more fuel-efficient propulsion for spacecraft. Additionally, plasma technology could enable the production of valuable chemicals such as ammonia

    energyplasma-technologyfusion-energysemiconductor-manufacturingspacecraft-propulsionrenewable-energyadvanced-materials
  • Tesla signs $16.5B deal with Samsung to make AI chips

    Tesla has entered a $16.5 billion agreement with Samsung to manufacture its next-generation AI6 chips, which are designed to power a wide range of Tesla technologies, from its Full Self-Driving (FSD) system to Optimus humanoid robots and AI training in data centers. Samsung’s new Texas fabrication plant will be dedicated to producing these AI6 chips, marking a significant expansion in Tesla’s chip manufacturing capabilities. Elon Musk also mentioned that Tesla is collaborating with TSMC for its AI5 chips, which have recently completed design and will initially be produced in TSMC’s Taiwan and Arizona facilities. Samsung already produces Tesla’s A14 chip, and this new deal represents a major boost for Samsung’s chip-making ambitions after previous struggles to secure large clients. Musk indicated that Tesla’s spending on Samsung chips could exceed the initial $16.5 billion deal, with actual production output expected to be several times higher. Additionally, Tesla will assist Samsung in optimizing manufacturing efficiency at the Texas fab,

    robotAI-chipsTeslaSamsungautonomous-drivinghumanoid-robotssemiconductor-manufacturing
  • Intel to lay off up to 20% of Intel Foundry workers

    Intel plans to lay off 15% to 20% of its Intel Foundry division workforce starting in July 2025, according to an internal memo reported by The Oregonian. The Intel Foundry division, which designs, manufactures, and packages semiconductors for external clients, will see significant job cuts, although the exact number of affected employees has not been disclosed. With Intel's total workforce at approximately 108,900 as of December 2024, this reduction represents a substantial downsizing within the division. These layoffs align with strategic changes initiated by Intel’s CEO Lip-Bu Tan, who took over in March 2025 and has focused on streamlining the company’s core business units, flattening organizational structure, and reinforcing an engineering-first approach. The move follows previous layoffs of around 15,000 employees in August 2024 and was foreshadowed by Tan’s statements at the Intel Vision conference earlier in the year. Intel has not provided further details beyond the internal memo

    materialssemiconductorsIntel-Foundrysemiconductor-manufacturingchip-productionworkforce-reductiontech-industry
  • Nuclear reactors, semiconductors to get smarter with next-gen US plasma tech

    energyplasma-technologynuclear-reactorssemiconductor-manufacturingcomputational-physicsindustrial-processessimulation-tools
  • Bosch Ventures is turning its attention to North America with new $270M fund

    energy-efficiencyautomotiveclimate-techsemiconductor-manufacturingAI-in-manufacturingdeep-tech-startupsNorth-America-investments
  • Interview with Amina Mević: Machine learning applied to semiconductor manufacturing

    robotIoTenergymaterialsmachine-learningsemiconductor-manufacturingvirtual-metrology